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Multi-chip module
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#	Item
11	PROJECT PROFILE 2T401: Hi-frequency microsystems on silicon (HI-MISSION) ENABLING TECHNOLOGIES FOR HETEROGENEOUS SYSTEMS Add to Reading List Source URL: www.catrene.org Language: English - Date: 2009-03-25 10:36:12 Integrated circuits Electronic design Semiconductor devices Logic families Microelectromechanical systems Silicon-germanium Gallium arsenide Multi-chip module CMOS Electronics Electronic engineering Technology
12	Multi-chip VCSEL Array Module kW-class (QCW) for End Pumping of Solid-State Lasers Part # PQCW-EP-800-W0808 • Vertical-Cavity Surface-Emitting Laser technology • Uniform pumping & reliable operation Add to Reading List Source URL: www.princetonoptronics.com Language: English - Date: 2013-02-12 13:01:36 Directed-energy weapons Medical equipment Acronyms Laser Photonics Yttrium aluminium garnet Nd:YAG laser Vertical-cavity surface-emitting laser Laser pointer Optics Physics Optical materials
13	Security Policy for the Standard NetFortress® VPN Level 2 Multi-Chip Standalone Module 1 Table of Contents Add to Reading List Source URL: csrc.nist.gov Language: English - Date: 2007-09-19 01:00:00 Zeroisation Computer security Access control Security Cryptography standards FIPS 140-2
14	rmance PWB sMultimission, multifunction LTCC Solutions for space & defense Add to Reading List Source URL: www.anaren.com Language: English - Date: 2013-12-17 15:57:17 Electronic engineering Hybrid integrated circuit Multi-chip module Printed circuit board Integrated circuit Low temperature co-fired ceramic Electromagnetism Electronics Electronics manufacturing
15	RF multi-chip modules Anaren’s RF/microwave performance — now available in world-class, highprecision modular packaging Today’s Anaren offers a wide variety of RF module capabilities to suit next-generation defense Add to Reading List Source URL: www.anaren.com Language: English - Date: 2013-12-17 16:01:18 Engineering Broadcast engineering Electromagnetic spectrum RF engineering Radio spectrum Electromagnetism Electronic engineering Electrical engineering
16	PDF Document Add to Reading List Source URL: material.htlwien10.at Language: English - Date: 2001-07-05 08:47:30 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering
17	PDF Document Add to Reading List Source URL: nepp.nasa.gov Language: English - Date: 2005-07-22 21:03:59 Semiconductor device fabrication Electronics manufacturing Integrated circuits Multi-chip module Chip scale package Ball grid array Printed circuit board Dual in-line package Three-dimensional integrated circuit Electronics Electronic engineering Electromagnetism
18	PDF Document Add to Reading List Source URL: eestud.kku.ac.th Language: English - Date: 2003-02-27 06:00:26 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering

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